Design & R&D

Process capability

Picture Name

Assembly and testing of finished products

Provide one-stop PCBA+mould+hardware+injection+testing+assembly services. Reliability test (high temperature and high humidity, hot and cold shock...)

Picture Name

Three-proof process capability

Three-proof coating automatic production line Can support different thickness of coating requirements Can support needle valve, atomised valve spraying

Picture Name

PCBA Testing

ICT Testing FCT Testing FA Analysis (3rd party support) On line/off line burn-in testing Complete solutions for testing are available

Picture Name

Welding capacity

N₂ Process (SMT, Wave) Ersa Selective Wave Soldering Automated Soldering Machines / Soldering Arms

Picture Name

Detection capability

SPI: Koh young 3D KY8030-2 AOI: TRI 7710 X-Ray：Shimadzu SMX-2000

Picture Name

SMT capability (FUJI NXTIII)

Minimum Patch Part Size (inch): 01005 Maximum PCB size (mm): 610*534 Maximum number of PCB layers (layers): 20 Maximum number of components on a single board (pcs): 3200

Major equipment

Picture Name

Haipai Coating

Picture Name

Ersa Selective Wave

Picture Name

JT WAVE +N₂

Picture Name

TRI AOI

Picture Name

HB Reflow Oven+ N₂

Picture Name

FUJI NXT-M6 III

Picture Name

FUJI NXT-M3 III

Picture Name

KY SPI

Picture Name

MPM